Wire & Ribbon
Wire bonding and establishing electrical connectivity
A large number of applications for wires and strips are found in microelectronics and power electronics components. The wire-bonding process is an established method in this industry producing electrically conductive connections within confined spaces.
These wires and ribbons are available in platinum, gold, silver, copper and aluminium depending on the application. Dopants can also be added to the pure elements in order to obtain the desired properties.
Important factors influencing choice of material for the bonding process are looping behaviour, thermal conductivity, mechanical and chemical stress.