Soldering
Low temperature melting alloys for zinc, tin and copper alloys.
Soldering in electronics has the goal of creating electrical contact rather than the creation of high-strength joints.
Different alloys are used depending on the requirements.
Products
| Product | Properties | |
|---|---|---|
| 99.99Sn | high strength | RFQ |
| 99.3Sn0.7Cu | for simple applications low cost dissolves copper at high temperatures | RFQ |
| 99Sn | high strength | RFQ |
| 97Sn3Cu | for high temperature application | RFQ |
| 95Sn5Sb | high shear strength low thermo-dynamic fatigue | RFQ |
| 85Sn15Zn | high strength high corrosion resistance | RFQ |
| 77.2Sn20In2.8Ag | Eutectic at 118°C | RFQ |
| 52In48Sn | good wetting characteristics low melting temperature | RFQ |
| 97In3Ag | high strength good wetting characteristics low melting temperature | RFQ |
| 90In10Ag | good wetting characteristics low melting temperature | RFQ |
| Au82-In Solder | good wetting characteristics high melting point | RFQ |
| Sn96.5Ag3.5
Sn95Ag5 Sn94Ag6 | higher strength compared to SnPb solder alloys | RFQ |