Paste & Powder

For surface and screen-printing application

Our pastes and powders are applied in thick film technology for printing of circuit boards and assembling of SMT-components.

Depending on the application, different materials with different grain sizes are available.

Products	Properties
Tin	good wetting behaviour no piping	RFQ
Silver / Tin	high melting point high corrosion resistance high thermal conductivity high tensile strength	RFQ
Silver / Copper / Tin	high strength high ductility	RFQ

Note

Illustrated assortment is an abstract of available materials only